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ARM y TSMC presentan el Cortex-A57, primer chip de 16 nm

El diseñador británico ARM y la mayor foundry mundial, TSMC, han informado de la producción de los primeros prototipos de los nuevos chips Cortex-A57, los primeros fabricados en procesos tecnológicos de 16 nanómetros.

El Cortex-A57 está diseñado para un buen número de sectores, desde la computación móvil de gama alta (superphones), tablet PC e incluso aplicaciones empresariales de cálculo intensivo para servidores.

El Cortex-A57 es el primer hito en la cooperación entre ARM y TSMC para optimizar la serie ARMv8 de 64 bits.

El desarrollo será el primer SoC de la industria fabricado en procesos de 16 nanómetros utilizando la tecnología de proceso FinFET.

Se espera el comienzo de la producción masiva en un plazo de seis meses por lo que el Cortex-A57 estaría disponible en productos comerciales a comienzos de 2014.

[expand]Hsinchu, Taiwan and Cambridge, UK – April 2, 2013 – ARM and TSMC (TWSE: 2330, NYSE: TSM) today announced the first tape-out of an ARM® Cortex™-A57 processor on FinFET process technology. The Cortex-A57 processor is ARM’s highest performing processor, designed to further extend the capabilities of future mobile and enterprise computing, including compute intensive applications such as high-end computer, tablet and server products. This is the first milestone in the collaboration between ARM and TSMC to jointly optimize the 64-bit ARMv8 processor series on TSMC FinFET process technologies. The two companies cooperated in the implementation from RTL to tape-out in six months using ARM Artisan® physical IP, TSMC memory macros, and EDA technologies enabled by TSMC’s Open Innovation Platform® (OIP) design ecosystem.

ARM and TSMC’s collaboration produces optimized, power-efficient Cortex-A57 processors and libraries to support early customer implementations on 16nm FinFET for high-performance, ARM technology-based SoCs.

“This first ARM Cortex-A57 processor implementation paves the way for our mutual customers to leverage the performance and power efficiency of 16nm FinFET technology,” said Tom Cronk, executive vice president and general manager, Processor Division, ARM. “The joint effort of ARM, TSMC, and TSMC’s OIP design ecosystem partners demonstrates the strong commitment to provide industry-leading technology for customer designs to benefit from our latest 64-bit ARMv8 architecture, big.LITTLE™ processing and ARM POP™ IP across a wide variety of market segments.”

“Our multi-year, multi-node collaboration with ARM continues to deliver advanced technologies to enable market-leading SoCs across mobile, server, and enterprise infrastructure applications,” said Dr. Cliff Hou, TSMC Vice President of R&D. “This achievement demonstrates that the next-generation ARMv8 processor is FinFET-ready for TSMC’s advanced technology.”

This announcement highlights the enhanced and intensified collaboration between ARM and TSMC. The test chip was implemented using a commercially available 16nm FinFET tool chain and design services provided by the OIP ecosystem and ARM Connected Community partners. This successful collaborative milestone is confirmation of the roles that TSMC’s OIP and ARM’s Connected Community play in promoting innovation for the semiconductor design industry.[/expand]

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Juan Ranchal
Editor de la publicación on-line líder en audiencia dentro del canal de distribución. Al día de todas las tecnologías que pueden marcar tendencia en la industria.

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